US Patent Issued to Monolithic 3D on April 21 for "3D semiconductor devices and structures with functional units and pillars" (American, Israeli Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,563, issued on April 21, was assigned to Monolithic 3D Inc. (Allen, Texas).

"3D semiconductor devices and structures with functional units and pillars" was invented by Zvi Or-Bach (Haifa, Israel), Jin-Woo Han (San Jose, Calif.) and Brian Cronquist (New Salisbury, Ind.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D device including: a first level including first transistors, a first interconnect; a second level including second transistors, the second level overlaying the first level and bonded to each other includes metal to metal bonding regions; at least four functional units each includes a first circuit which includes a portion of the firs...