US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Methods of forming bonding structures" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,562, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods of forming bonding structures" was invented by Hsing-Yuan Huang (Hsinchu, Taiwan), Chin-Szu Lee (Taoyuan, Taiwan) and Yi Chen Ho (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a conductive pad over a substrate, forming a multi-layer passivation structure on the conducive pad, patterning a top portion of the multi-layer passivation structure to form a first opening, forming a mask film on sidewall surfaces of the patterned top portion of the multi-layer passivation structure, after the formi...