ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,569, issued on June 30, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate analysis system, substrate analysis method, and recording m... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,570, issued on June 30, was assigned to Carl Zeiss SMT GmbH (Oberkochen, Germany). "3D volume inspection method and method of configuring o... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,571, issued on June 30, was assigned to Mitsubishi Electric Research Laboratories Inc. (Cambridge, Mass.). "System and method for tomograph... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,572, issued on June 30, was assigned to BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,573, issued on June 30, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea) and NSYS Corp.. "System for finding black spots in a ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,574, issued on June 30, was assigned to SK On Co. Ltd. (Seoul, South Korea). "Apparatus and method for predicting weld quality" was invente... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,575, issued on June 30, was assigned to ASML Netherlands B.V. (Veldoven, Netherlands). "Patterning parameter determination using a charged ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,576, issued on June 30, was assigned to INTER X Co. LTD. (Ulsan, South Korea). "AI-based apparatus and method for detecting a defect of a p... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,577, issued on June 30, was assigned to NEC Corp. (Tokyo). "Video management apparatus, video management method, and program" was invented ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,578, issued on June 30, was assigned to Siemens Industry Software Inc. (Plano, Texas). "Layout-based wafer defect identification and classi... Read More