ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,569, issued on June 30, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate analysis system, substrate analysis method, and recording m... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,570, issued on June 30, was assigned to Carl Zeiss SMT GmbH (Oberkochen, Germany). "3D volume inspection method and method of configuring o... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,571, issued on June 30, was assigned to Mitsubishi Electric Research Laboratories Inc. (Cambridge, Mass.). "System and method for tomograph... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,572, issued on June 30, was assigned to BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). ... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,573, issued on June 30, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea) and NSYS Corp.. "System for finding black spots in a ... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,574, issued on June 30, was assigned to SK On Co. Ltd. (Seoul, South Korea). "Apparatus and method for predicting weld quality" was invente... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,575, issued on June 30, was assigned to ASML Netherlands B.V. (Veldoven, Netherlands). "Patterning parameter determination using a charged ... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,576, issued on June 30, was assigned to INTER X Co. LTD. (Ulsan, South Korea). "AI-based apparatus and method for detecting a defect of a p... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,577, issued on June 30, was assigned to NEC Corp. (Tokyo). "Video management apparatus, video management method, and program" was invented ... और पढ़ें
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,578, issued on June 30, was assigned to Siemens Industry Software Inc. (Plano, Texas). "Layout-based wafer defect identification and classi... और पढ़ें