US Patent Issued to Carl Zeiss SMT on June 30 for "3D volume inspection method and method of configuring of a 3D volume inspection method" (German, American Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,570, issued on June 30, was assigned to Carl Zeiss SMT GmbH (Oberkochen, Germany).

"3D volume inspection method and method of configuring of a 3D volume inspection method" was invented by Thomas Korb (Schwaebisch Gmuend, Germany), Eugen Foca (Ellwangen, Germany), Philipp Huethwohl (Ulm, Germany), Dmitry Klochkov (Schwaebisch Gmuend, Germany), Jens Timo Neumann (Aalen, Germany), Ramani Pichumani (Palo Alto, Calif.) and Keumsil Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of 3D-inspection of a semiconductor object inside of an inspection volume of a wafer or wafer sample comprises a 3D data processing and a step for a...