US Patent Issued to Siemens Industry Software on June 30 for "Layout-based wafer defect identification and classification using separately generated predicted images and predicted layout designs" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,670,578, issued on June 30, was assigned to Siemens Industry Software Inc. (Plano, Texas).

"Layout-based wafer defect identification and classification using separately generated predicted images and predicted layout designs" was invented by Nataraj Akkiraju (Fremont, Calif.) and Qian Xie (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This application discloses a scanning electron microscope system to capture an image of an electronic device manufactured according to a layout design describing the electronic device, and a computing system to generate a predicted image of the electronic device using the layout design. The predicted imag...