US Patent Issued to International Business Machines on May 19 for "Replacement buried power rail" (New York Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,491, issued on May 19, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Replacement buried power rail" was invented by... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Package component with stepped passivation layer" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,492, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package component with stepped passiv... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "All-tungsten scheme for source/drain contact, source/drain via, and gate via" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,493, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "All-tungsten scheme for source/dr... Read More

US Patent Issued to Applied Materials on May 19 for "Embedding redistribution layer metal traces in a polymeric dielectric" (Singaporean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,494, issued on May 19, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Embedding redistribution layer metal traces in a polym... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Patterning material including carbon-containing layer and method for semiconductor device fabrication" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,495, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Patterning material including car... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Semiconductor device including interconnects with lower contact resistance" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,496, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device including in... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Semiconductor arrangement and method for making" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,497, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd. (Hsin-Chu, Taiwan). "Semiconductor arrangement and me... Read More

US Patent Issued to International Business Machines on May 19 for "Stacked devices with backside contacts" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,498, issued on May 19, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Stacked devices with backside contacts" was in... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Through substrate via landing on front end of line structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,499, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Through substrate via landing on fron... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Semiconductor device and method having high-kappa bonding layer" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,500, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method havin... Read More

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