US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Package component with stepped passivation layer" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,492, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package component with stepped passivation layer" was invented by Ming-Da Cheng (Taoyuan City, Taiwan), Tzy-Kuang Lee (Taichung, Taiwan), Song-Bor Lee (Zhubei City, Taiwan), Wen-Hsiung Lu (Tainan City, Taiwan), Po-Hao Tsai (Taoyuan City, Taiwan) and Wen-Che Chang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a first conductive feature, depositing a passivation layer on a sidewall and a top surface of the first conductive feature, etching the passivation layer to reveal the first conductive feature, and re...