US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Semiconductor device including interconnects with lower contact resistance" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,496, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device including interconnects with lower contact resistance" was invented by Hsi-Wen Tien (Hsinchu, Taiwan), Hwei-Jay Chu (Hsinchu, Taiwan), Chia-Tien Wu (Hsinchu, Taiwan), Yung-Hsu Wu (Hsinchu, Taiwan), Wei-Hao Liao (Hsinchu, Taiwan), Yu-Teng Dai (Hsinchu, Taiwan), Hsin-Chieh Yao (Hsinchu, Taiwan), Hsin-Ping Chen (Hsinchu, Taiwan) and Chih-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, an interconnect layer disposed over the substrate and including a metal line,...