US Patent Issued to DENSO, TOYOTA JIDOSHA, MIRISE Technologies on May 19 for "Semiconductor wafer manufacturing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,480, issued on May 19, was assigned to DENSO Corp. (Kariya-city, Japan), TOYOTA JIDOSHA K.K. (Toyota, Japan) and MIRISE Technologies Corp. (N... Read More

US Patent Issued to DISCO on May 19 for "Chuck table and manufacturing method of chuck table" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,481, issued on May 19, was assigned to DISCO Corp. (Tokyo). "Chuck table and manufacturing method of chuck table" was invented by Masaru Nak... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Method of forming a pattern of semiconductor device of a semiconductor device on a semiconductor substrate by using an extreme ultraviolet mask" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,482, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method of forming a pattern of semiconductor d... Read More

US Patent Issued to ASM IP Holding on May 19 for "Method and system for forming material within a gap using meltable material" (Belgian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,483, issued on May 19, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Method and system for forming material within a gap using... Read More

US Patent Issued to Semiconductor Energy Laboratory on May 19 for "Manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,485, issued on May 19, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Japan). "Manufacturing method of semiconductor device" was ... Read More

US Patent Issued to NEXCHIP SEMICONDUCTOR on May 19 for "Semiconductor device and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,486, issued on May 19, was assigned to NEXCHIP SEMICONDUCTOR Corp. (Hefei, China). "Semiconductor device and manufacturing method thereof" w... Read More

US Patent Issued to International Business Machines on May 19 for "Semiconductor backside isolation feature for merged epitaxy" (New York Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,487, issued on May 19, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Semiconductor backside isolation feature for m... Read More

US Patent Issued to TEXAS INSTRUMENTS on May 19 for "Merged trenches surrounded by wider trench for isolating semiconductor devices" (Texas, California Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,488, issued on May 19, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Merged trenches surrounded by wider trench for isolating semiconduc... Read More

US Patent Issued to DB HiTek on May 19 for "High voltage semiconductor device and method of manufacturing same" (South Korean Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,489, issued on May 19, was assigned to DB HiTek Co. Ltd. (Bucheon-si, South Korea). "High voltage semiconductor device and method of manufac... Read More

US Patent Issued to DB HiTek on May 19 for "Deep trench isolation including air gap and embossed portion and method of manufacturing same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,490, issued on May 19, was assigned to DB HiTek Co. Ltd. (Bucheon-si, South Korea). "Deep trench isolation including air gap and embossed po... Read More

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