US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Memory device, and method for forming thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,121, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Memory device, and method for forming... Read More

US Patent Issued to Atomera on May 19 for "Multi-chip memory system including DRAM chips with integrated comparator arrays and method of operating same" (Texas Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,122, issued on May 19, was assigned to Atomera Inc. (Los Gatos, Calif.). "Multi-chip memory system including DRAM chips with integrated comp... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,123, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and method of fabricating... Read More

US Patent Issued to Micron Technology on May 19 for "Vertically stacked storage nodes and access devices with vertical access lines" (Idaho Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,124, issued on May 19, was assigned to Micron Technology Inc. (Boise, Idaho). "Vertically stacked storage nodes and access devices with vert... Read More

US Patent Issued to SK hynix, University-Industry Cooperation Group of Kyung Hee University on May 19 for "Method of forming thin film, method of forming thin film structure, method of manufacturing capacitor, capacitor and memory device including the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,125, issued on May 19, was assigned to SK hynix Inc. (Icheon, South Korea) and University-Industry Cooperation Group of Kyung Hee University ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Semiconductor memory devices including stepwise profiles and methods of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,126, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor memory devices including stepwis... Read More

US Patent Issued to Fujian Jinhua Integrated Circuit on May 19 for "Semiconductor memory device and method for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,127, issued on May 19, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Semiconductor memory device and me... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 19 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,128, issued on May 19, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and manuf... Read More

US Patent Issued to NANYA TECHNOLOGY on May 19 for "Manufacturing method of semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,129, issued on May 19, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Manufacturing method of semiconductor structure" w... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Semiconductor device including gate structure" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,130, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including gate structure"... Read More

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