US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor device and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,865, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor device and semiconductor pac... Read More

US Patent Issued to National Yang Ming Chiao Tung University on April 21 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,866, issued on April 21, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan). "Semiconductor device and method... Read More

US Patent Issued to SAMSUNG DISPLAY on April 21 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,867, issued on April 21, was assigned to SAMSUNG DISPLAY Co. LTD. (Yongin-si, South Korea). "Display device" was invented by Young Min Par... Read More

US Patent Issued to SJ Semiconductor(Jiangyin) on April 21 for "Fan-out stacked semiconductor package structure and packaging method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,868, issued on April 21, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Fan-out stacked semiconductor package s... Read More

US Patent Issued to QUALCOMM on April 21 for "Integrated circuit (IC) package employing a metal block with metal interconnects thermally coupling a die to an interposer substrate for dissipating thermal energy of the die, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,869, issued on April 21, was assigned to QUALCOMM Inc. (San Diego). "Integrated circuit (IC) package employing a metal block with metal in... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,870, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure and manuf... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Through-dielectric vias for direct connection and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,871, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Through-dielectric vias for direc... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 21 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,873, issued on April 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Integrated circuit package and me... Read More

US Patent Issued to SHINKO ELECTRIC INDUSTRIES, SHINSHU UNIVERSITY on April 21 for "Connection structural body with Cu-Cu bonding and roughened surface deposits" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,874, issued on April 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan) and SHINSHU UNIVERSITY (Matsumoto City, Japan)... Read More

US Patent Issued to Wistron NeWeb on April 21 for "Package structure having second adhesive between side surface of semiconductor package and first adhesive" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,875, issued on April 21, was assigned to Wistron NeWeb Corp. (Hsinchu, Taiwan). "Package structure having second adhesive between side sur... Read More

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