US Patent Issued to QUALCOMM on April 21 for "Integrated circuit (IC) package employing a metal block with metal interconnects thermally coupling a die to an interposer substrate for dissipating thermal energy of the die, and related fabrication methods" (California Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,869, issued on April 21, was assigned to QUALCOMM Inc. (San Diego).

"Integrated circuit (IC) package employing a metal block with metal interconnects thermally coupling a die to an interposer substrate for dissipating thermal energy of the die, and related fabrication methods" was invented by Kuiwon Kang (San Diego), Joan Rey Villarba Buot (Escondido, Calif.), Bohan Yan (San Diego) and Manuel Aldrete (Encinitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects disclosed in the detailed description include an integrated circuit (IC) package employing a metal block with metal interconnects thermally coupling a semiconductor die ("die") t...