US Patent Issued to Taiwan Semiconductor Manufacturing on April 21 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,870, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure and manufacturing method thereof" was invented by Chung-Liang Cheng (Changhua, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Some implementations described herein provide a semiconductor structure. The semiconductor structure may include a logic device disposed, at a first side of the logic device, on a carrier wafer of the semiconductor structure. The semiconductor structure may include a dielectric structure disposed on a second side of the logic device, the second side being opposite the first side. The semicon...