US Patent Issued to Wistron NeWeb on April 21 for "Package structure having second adhesive between side surface of semiconductor package and first adhesive" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,875, issued on April 21, was assigned to Wistron NeWeb Corp. (Hsinchu, Taiwan).

"Package structure having second adhesive between side surface of semiconductor package and first adhesive" was invented by Kuo-Hua Hsieh (Hsinchu, Taiwan), Chao-Chieh Chan (Hsinchu, Taiwan), Yu-Da Dong (Hsinchu, Taiwan) and Chun-Jen Cheng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a method for fabricating the same are provided. The package structure includes a substrate, a semiconductor package, a first adhesive and a second adhesive. The substrate has a first board surface and a second board surface, and a second region sur...