ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,866, issued on April 21, was assigned to National Yang Ming Chiao Tung University (Hsinchu City, Taiwan).
"Semiconductor device and method of manufacturing the same" was invented by Kuan-Neng Chen (Hsinchu City, Taiwan), Yi-Chieh Tsai (Taoyuan City, Taiwan), Demin Liu (Hsinchu City, Taiwan) and Han-Wen Hu (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment of the present application provides a semiconductor device, including a substrate, a chip, a latch-up protection circuit, and a redistribution layer. The chip is on the substrate. The latch-up protection circuit is separated from the chip in a direction. The redis...