US Patent Issued to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT on April 21 for "Method for manufacturing semiconductor device including forming opening in resist of the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,840, issued on April 21, was assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT Co. LTD. (Osaka, Japan). "Method for manufacturing sem... Read More

US Patent Issued to PROTEC on April 21 for "Method of bonding column type deposits" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,841, issued on April 21, was assigned to PROTEC Co. LTD. (Gyeonggi-do, South Korea). "Method of bonding column type deposits" was invented... Read More

US Patent Issued to Innolux on April 21 for "Electronic device including an underfill layer and a protective structure adjacent to the underfill layer" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,842, issued on April 21, was assigned to Innolux Corp. (Miao-Li County, Taiwan). "Electronic device including an underfill layer and a pro... Read More

US Patent Issued to NANYA TECHNOLOGY on April 21 for "Semiconductor structure having dummy conductive member and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,843, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure having dummy conductiv... Read More

US Patent Issued to EngeniusMicro on April 21 for "Systems and methods for additive connections in integrated circuits" (Alabama Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,844, issued on April 21, was assigned to EngeniusMicro LLC (Huntsville, Ala.). "Systems and methods for additive connections in integrated... Read More

US Patent Issued to Tokyo Electron on April 21 for "Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process" (New York Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,845, issued on April 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Method for forming semiconductor packages using dielectric alignmen... Read More

US Patent Issued to CR RUNAN TECHNOLOGIES (CHONGQING) on April 21 for "Semiconductor encapsulation method and semiconductor encapsulation structure" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,846, issued on April 21, was assigned to CR RUNAN TECHNOLOGIES (CHONGQING) Co. LTD. (Chongqing, China). "Semiconductor encapsulation metho... Read More

US Patent Issued to SKY CHIP INTERCONNECTION TECHNOLOGY on April 21 for "Packaging method and package member" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,847, issued on April 21, was assigned to SKY CHIP INTERCONNECTION TECHNOLOGY Co. LTD. (Shenzhen, China). "Packaging method and package mem... Read More

US Patent Issued to Murata Manufacturing on April 21 for "Electronic component and method for forming resin layer on electronic component" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,848, issued on April 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Electronic component and method for forming resin ... Read More

US Patent Issued to PANJIT INTERNATIONAL on April 21 for "Semiconductor packaging structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,849, issued on April 21, was assigned to PANJIT INTERNATIONAL INC. (Kaohsiung City, Taiwan). "Semiconductor packaging structure" was inven... Read More

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