US Patent Issued to Tokyo Electron on April 21 for "Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process" (New York Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,845, issued on April 21, was assigned to Tokyo Electron Ltd. (Tokyo).

"Method for forming semiconductor packages using dielectric alignment marks and laser liftoff process" was invented by Kevin Ryan (Albany, N.Y.), Hirokazu Aizawa (Albany, N.Y.), Kaoru Maekawa (Albany, N.Y.), Satohiko Hoshino (Albany, N.Y.) and Yoshihiro Tsutsumi (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for making forming a semiconductor package comprises forming a plurality of alignment marks in or on a carrier substrate; positioning and bonding a plurality of semiconductor dies to the carrier substrate based on the plurality of alignment marks; furth...