US Patent Issued to Murata Manufacturing on April 21 for "Electronic component and method for forming resin layer on electronic component" (Japanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,848, issued on April 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan).

"Electronic component and method for forming resin layer on electronic component" was invented by Naganori Hirakawa (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component includes a plurality of laminated insulating layers, one or more surface conductors formed on a surface of the insulating layer, and an internal conductor formed at a boundary portion between the adjacent insulating layers. A thickness of the surface conductor is larger than a thickness of a thinnest layer of the insulating layers and larger than a thickness of...