ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,841, issued on April 21, was assigned to PROTEC Co. LTD. (Gyeonggi-do, South Korea).
"Method of bonding column type deposits" was invented by Youn Sung Ko (Gyeonggi-do, South Korea) and Geunsik Ahn (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a method of bonding column type deposits to a substrate, and more specifically, to a method of bonding to a substrate column type deposits, which are formed in a column shape and connect the substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. A method of bonding column type deposits to a substrate acc...