US Patent Issued to SKY CHIP INTERCONNECTION TECHNOLOGY on April 21 for "Packaging method and package member" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,847, issued on April 21, was assigned to SKY CHIP INTERCONNECTION TECHNOLOGY Co. LTD. (Shenzhen, China).

"Packaging method and package member" was invented by Yuhong Li (Shenzhen, China), Haoyang Xiao (Shenzhen, China), Chenshan Gao (Shenzhen, China), Guanqiang Song (Shenzhen, China) and Jing Jiang (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging method includes: obtaining a carrier and processing a first pad on a side surface of the carrier; processing a second pad on a side surface of the first pad away from the carrier; obtaining a first sealing material, pressing the first sealing material with the second pad, the fir...