US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Via structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,122, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Via structure and method for fo... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,123, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and method of fabric... Read More

US Patent Issued to Invention and Collaboration Laboratory on July 14 for "Memory array circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,124, issued on July 14, was assigned to Invention and Collaboration Laboratory Inc. (Taipei City, Taiwan). "Memory array circuit" was inven... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,126, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interconnect structure" was invente... Read More

US Patent Issued to International Business Machines on July 14 for "Method and structure of forming barrier-less skip via with subtractive metal patterning" (New York, Vermont Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,127, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Method and structure of forming barrier-less... Read More

US Patent Issued to International Business Machines on July 14 for "Frontside to backside connection within double diffusion break" (Utah, New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,128, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Frontside to backside connection within doub... Read More

US Patent Issued to SK hynix on July 14 for "Semiconductor device and method of manufacturing semiconductor device" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,129, issued on July 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device and method of manufacturing semicondu... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Sidewall spacer structure enclosing conductive wire sidewalls to increase reliability" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,130, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Sidewall spacer structure enclosing... Read More

US Patent Issued to KIOXIA on July 14 for "Semiconductor device and method for producing the same" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,131, issued on July 14, was assigned to KIOXIA Corp. (Tokyo). "Semiconductor device and method for producing the same" was invented by Atsu... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Aluminum structures" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,132, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Aluminum structures" was invent... Read More

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