US Patent Issued to International Business Machines on July 14 for "Method and structure of forming barrier-less skip via with subtractive metal patterning" (New York, Vermont Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,127, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Method and structure of forming barrier-less skip via with subtractive metal patterning" was invented by Ruilong Xie (Niskayuna, N.Y.), Nicholas Anthony Lanzillo (Wynantskill, N.Y.), Huai Huang (Clifton Park, N.Y.), Hosadurga Shobha (Niskayuna, N.Y.), Lawrence A. Clevenger (Saratoga Springs, N.Y.) and Brent A Anderson (Jericho, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic structure including a first metal line, a second metal line, and a third metal line. A skip-via connecting the first metal line to the third metal line, where the ...