US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,126, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interconnect structure" was invented by Shao-Kuan Lee (Kaohsiung City, Taiwan), Hsin-Yen Huang (New Taipei City, Taiwan), Cheng-Chin Lee (Taipei City, Taiwan), Kuang-Wei Yang (Hsinchu, Taiwan), Ting-Ya Lo (Hsinchu, Taiwan), Chi-Lin Teng (Taichung City, Taiwan), Hsiao-Kang Chang (Hsinchu City, Taiwan) and Shau-Lin Shue (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first interconnect and a second interconnect disposed within a...