US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Aluminum structures" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,132, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Aluminum structures" was invented by Chia-Pang Kuo (Taoyuan, Taiwan), Sean Yang (Taipei, Taiwan), Yue-Guo Lin (Hsinchu, Taiwan), Tsai Hsi-Chen (Hsinchu, Taiwan), Chi-Feng Lin (Hsinchu, Taiwan) and Hung-Wen Su (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Devices with aluminum structures and methods of fabrication are provided. An exemplary device includes an interconnect structure and an aluminum structure electrically connected to the interconnect structure. The aluminum structure includes a first aluminum layer, a migration...