US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Aluminum structures" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,132, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Aluminum structures" was invent... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Ruthenium oxide film and ruthenium liner for low-resistance copper interconnects in a device" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,133, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Ruthenium oxide film and ruthenium ... Read More

US Patent Issued to International Business Machines on July 14 for "Local frontside power rail with global backside power delivery" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,134, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Local frontside power rail with global backs... Read More

US Patent Issued to International Business Machines on July 14 for "Local interconnect formation at double diffusion break" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,135, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Local interconnect formation at double diffu... Read More

US Patent Issued to International Business Machines on July 14 for "Interconnect through gate cut for stacked FET device" (New York, Vermont Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,136, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect through gate cut for stacked FE... Read More

US Patent Issued to INTERNATIONAL BUSINESS MACHINES on July 14 for "Wire structure for low resistance interconnects" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,137, issued on July 14, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Wire structure for low resistance interconne... Read More

US Patent Issued to NANYA TECHNOLOGY on July 14 for "Semiconductor device with assisting layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,138, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with assisting layer and me... Read More

US Patent Issued to NANYA TECHNOLOGY on July 14 for "Interconnection structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,139, issued on July 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Interconnection structure and method for manufacturin... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Contact arrangements for deep trench capacitors" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,140, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Contact arrangements for deep trenc... Read More

US Patent Issued to UNITED MICROELECTRONICS on July 14 for "Semiconductor structure and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,141, issued on July 14, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and fabrication met... Read More

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