US Patent Issued to INTERNATIONAL BUSINESS MACHINES on July 14 for "Wire structure for low resistance interconnects" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,137, issued on July 14, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Wire structure for low resistance interconnects" was invented by Oscar van der Straten (Guilderland Center, N.Y.), Koichi Motoyama (Clifton Park, N.Y.) and Chih-Chao Yang (Glenmont, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Interconnect wire structures and techniques for fabrication thereof with uniform line profile and height are provided. In one aspect, a structure is provided that includes: a wafer; a first interlayer dielectric disposed on the wafer; a second interlayer dielectric disposed on the first interlayer dielectric; and an interconne...