US Patent Issued to NXP USA on April 7 for "Semiconductor device with active mold package and method therefor" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,004, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Semiconductor device with active mold package and method therefor" w... Read More

US Patent Issued to ZF Friedrichshafen on April 7 for "Power electronics module" (German Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,005, issued on April 7, was assigned to ZF Friedrichshafen AG (Friedrichshafen, Germany). "Power electronics module" was invented by Ake Ew... Read More

US Patent Issued to ROHM on April 7 for "Electronic device" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,006, issued on April 7, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Electronic device" was invented by Yuji Ishimatsu (Kyoto, Japan), Ke... Read More

US Patent Issued to Intel on April 7 for "Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate vias" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,007, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Composite IC die package including an electro-thermo-mechanical... Read More

US Patent Issued to NXP USA on April 7 for "Transistor with source manifold in non-active die region" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,008, issued on April 7, was assigned to NXP USA INC. (Austin, Texas). "Transistor with source manifold in non-active die region" was invent... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,009, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure" was invented by ... Read More

US Patent Issued to Intel on April 7 for "Microelectronic packages with embedded interposers" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,010, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic packages with embedded interposers" was invente... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on April 7 for "Semiconductor structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,011, issued on April 7, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More

US Patent Issued to Hitachi Energy on April 7 for "Free configurable power semiconductor module" (Swiss Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,012, issued on April 7, was assigned to Hitachi Energy Ltd (Zurich). "Free configurable power semiconductor module" was invented by Juergen... Read More

US Patent Issued to Intel on April 7 for "Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same" (Malaysian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,013, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor packages for stacked memory-on-package (SMOP) and... Read More

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