ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,010, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).
"Microelectronic packages with embedded interposers" was invented by Rahul N. Manepalli (Chandler, Ariz.) and Hamid Azimi (Chandler, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device comprises multiple integrated circuit (IC) dice disposed on a package substrate having a substrate area, a mold layer that includes the IC dice, and multiple conductive pillars extending from a surface of at least one IC die to a first surface of the mold layer, and an interposer layer extending over the substrate area and comprised of a stiffening material more rigid than...