US Patent Issued to Intel on April 7 for "Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same" (Malaysian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,013, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).

"Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the same" was invented by Bok Eng Cheah (Gelugor, Malaysia), Seok Ling Lim (Kulim Kedah, Malaysia), Jenny Shio Yin Ong (Bayan Lepas, Malaysia), Jackson Chung Peng Kong (Tanjung Tokong, Malaysia) and Kooi Chi Ooi (Gelugor, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a base die including a first die surface coupled to the package substrate, and a second die surface opposite to the first die surface, and a first device includ...