US Patent Issued to NXP USA on April 7 for "Semiconductor device with active mold package and method therefor" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,004, issued on April 7, was assigned to NXP USA INC. (Austin, Texas).

"Semiconductor device with active mold package and method therefor" was invented by Michael B. Vincent (Chandler, Ariz.) and Scott M. Hayes (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device is provided. The method includes forming a conductive die connector having a first end connected to a die pad of a semiconductor die. A first encapsulant formulated for selective activation by way of a laser encapsulates at least a portion of the semiconductor die. A first conductive trace of a redistribution layer is formed by plating a ...