Exclusive

Publication

Byline

Location

US Patent Issued to Semiconductor Energy Laboratory on Oct. 27 for "Semiconductor device having a metal oxide and method for manufacturing the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,853, issued on Oct. 27, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Atsugi, Japan). "Semiconductor device having a metal oxid... Read More


US Patent Issued to NANYA TECHNOLOGY on Oct. 27 for "Method of manufacturing semiconductor device" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,854, issued on Oct. 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Method of manufacturing semiconductor device" wa... Read More


US Patent Issued to KOKUSAI ELECTRIC on Oct. 27 for "Processing apparatus, processing method, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,855, issued on Oct. 27, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Processing apparatus, processing method, method of manufacturing s... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "N-dipole material for stacked transistors" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,856, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "N-dipole material for stacked t... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "By-site-compensated etch back for local planarization/topography adjustment" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,857, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "By-site-compensated etch back for l... Read More


US Patent Issued to Tokyo Electron on Oct. 27 for "Substrate processing method and substrate processing apparatus" (Japanese, American Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,858, issued on Oct. 27, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More


US Patent Issued to Hua Hong Semiconductor (Wuxi) on Oct. 27 for "Semiconductor structure and method for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,859, issued on Oct. 27, was assigned to Hua Hong Semiconductor (Wuxi) Ltd. (Wuxi, China). "Semiconductor structure and method for forming t... Read More


US Patent Issued to SCREEN Holdings on Oct. 27 for "Substrate treatment method and substrate treatment device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,860, issued on Oct. 27, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treatment method and substrate treatment device... Read More


US Patent Issued to Nanowatt on Oct. 27 for "Balanced multi-level power converter" (California Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,697, issued on Oct. 27, was assigned to Nanowatt Inc. (Milpitas, Calif.). "Balanced multi-level power converter" was invented by Owen Jong ... Read More


US Patent Issued to Skyworks Solutions on Oct. 27 for "Generation of positive and negative switch gate control voltages" (Texas Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,698, issued on Oct. 27, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Generation of positive and negative switch gate control ... Read More