US Patent Issued to KOKUSAI ELECTRIC on Oct. 27 for "Processing apparatus, processing method, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,855, issued on Oct. 27, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Processing apparatus, processing method, method of manufacturing semiconductor device, and recording medium" was invented by Takayuki Waseda (Toyama, Japan), Takashi Nakagawa (Toyama, Japan), Kimihiko Nakatani (Toyama, Japan), Motomu Degai (Toyama, Japan), Takao Izaki (Toyama, Japan) and Yoshitomo Hashimoto (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) modifying a surface of a first base exposed on a surface of a substrate to be terminated with a hydrocarbon group by supplying a hydrocarbon group-containing gas to...