US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Back end dielectric-based memory structure in a semiconductor device" (Taiwanese Inventors)

Posted On: 2026-10-27

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,909, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Back end dielectric-based memory st... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Fishbone structure enhancing spacing with adjacent conductive line in power network" (Taiwanese Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,910, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Fishbone structure enhancing sp... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Interconnection structure and methods of forming the same" (Taiwanese Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,911, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Interconnection structure and m... Read More

US Patent Issued to Intel on Oct. 27 for "Double-decked interconnect features" (Oregon Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,912, issued on Oct. 27, was assigned to Intel Corp. (Santa Clara, Calif.). "Double-decked interconnect features" was invented by June Choi ... Read More

US Patent Issued to Micron Technology on Oct. 27 for "Microelectronic devices including contact structures, and related memory devices, electronic systems, and methods" (Idaho Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,913, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices including contact structures, and r... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor device having a contact interface offset from a lowermost point of a source/drain upper surface" (South Korean Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,914, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a contact interf... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Methods of forming semiconductor devices including a capacitor and front and backside interconnect structures" (Taiwanese Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,915, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Methods of forming semiconductor de... Read More

US Patent Issued to Micron Technology on Oct. 27 for "Microelectronic devices including contact structures, and related electronic systems and methods" (Singaporean Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,916, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho). "Microelectronic devices including contact structures, and r... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Advanced node interconnect routing methodology" (Taiwanese Inventors)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,917, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Advanced node interconnect routing ... Read More

US Patent Issued to SK hynix on Oct. 27 for "Semiconductor device including a plug structure" (South Korean Inventor)

Posted On: 2026-10-27

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ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,918, issued on Oct. 27, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device including a plug structure" was inv... Read More

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US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Back end dielectric-based memory structure in a semiconductor device" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Fishbone structure enhancing spacing with adjacent conductive line in power network" (Taiwanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Interconnection structure and methods of forming the same" (Taiwanese Inventors)

US Patent Issued to Intel on Oct. 27 for "Double-decked interconnect features" (Oregon Inventors)

US Patent Issued to Micron Technology on Oct. 27 for "Microelectronic devices including contact structures, and related memory devices, electronic systems, and methods" (Idaho Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor device having a contact interface offset from a lowermost point of a source/drain upper surface" (South Korean Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Methods of forming semiconductor devices including a capacitor and front and backside interconnect structures" (Taiwanese Inventors)

US Patent Issued to Micron Technology on Oct. 27 for "Microelectronic devices including contact structures, and related electronic systems and methods" (Singaporean Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 27 for "Advanced node interconnect routing methodology" (Taiwanese Inventors)

US Patent Issued to SK hynix on Oct. 27 for "Semiconductor device including a plug structure" (South Korean Inventor)