US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 27 for "Interconnection structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,911, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interconnection structure and methods of forming the same" was invented by Cheng-Chin Lee (Taipei, Taiwan), Hsin-Yen Huang (New Taipei, Taiwan), Yen Ju Wu (Hsinchu, Taiwan), Shao-Kuan Lee (Kaohsiung, Taiwan), Kuang-Wei Yang (Hsinchu, Taiwan) and Hsiao-Kang Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor device structure is disclosed. The method includes forming one or more first conductive features in a first dielectric layer, forming a metal layer on each of the one or more first cond...