Exclusive

Publication

Byline

Location

US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Performance optimization by sizing gates and source/drain contacts differently for different transistors" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,406, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Performance optimization by sizing g... Read More


US Patent Issued to XIAMEN SAN'AN INTEGRATED CIRCUIT on May 12 for "Radio frequency device and radio frequency front-end apparatus" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,407, issued on May 12, was assigned to XIAMEN SAN'AN INTEGRATED CIRCUIT Co. LTD. (Xiamen, China). "Radio frequency device and radio frequenc... Read More


US Patent Issued to Renesas Electronics on May 12 for "Metal film and manufacturing method of the metal film, and semiconductor device and method of manufacturing the semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,408, issued on May 12, was assigned to Renesas Electronics Corp. (Tokyo). "Metal film and manufacturing method of the metal film, and semico... Read More


US Patent Issued to International Business Machines on May 12 for "Non-shared metal gate integration for scaled gate all around (GAA) transistors" (New York Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,410, issued on May 12, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Non-shared metal gate integration for scaled g... Read More


US Patent Issued to Tokyo Electron on May 12 for "Method of forming confined growth S/D contact defined by sidewall constraints with selective deposition of inner spacer for CFET" (New York Inventor)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,411, issued on May 12, was assigned to Tokyo Electron Ltd. (Tokyo). "Method of forming confined growth S/D contact defined by sidewall const... Read More


US Patent Issued to Vanguard International Semiconductor on May 12 for "Semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,413, issued on May 12, was assigned to Vanguard International Semiconductor Corp. (Hsinchu, Taiwan). "Semiconductor device" was invented by ... Read More


US Patent Issued to GLOBALFOUNDRIES U.S. on May 12 for "Semiconductor device including diffusion break structure and method of forming semiconductor device" (New York Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,414, issued on May 12, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Semiconductor device including diffusion break structure an... Read More


US Patent Issued to QUALCOMM on May 12 for "Post-replacement metal gate (RMG) gate cut for performance enhanced FinFET" (American, Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,415, issued on May 12, was assigned to QUALCOMM Inc. (San Diego). "Post-replacement metal gate (RMG) gate cut for performance enhanced FinFE... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on May 12 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,416, issued on May 12, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and manufact... Read More


US Patent Issued to QUALCOMM on May 12 for "Three-dimensional (3D) field effect transistors (FETs) with gate cuts to enhance carrier mobility and related fabrication methods" (American, Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,417, issued on May 12, was assigned to QUALCOMM Inc. (San Diego). "Three-dimensional (3D) field effect transistors (FETs) with gate cuts to ... Read More