ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,677, issued on July 14, was assigned to Canon K.K. (Tokyo). "Structural body, X-ray generation apparatus, X-ray computed tomography (CT) ap... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,678, issued on July 14, was assigned to SHIMADZU Corp. (Kyoto, Japan). "X-ray fluorescence spectrometer and power supply apparatus" was inv... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,679, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor system inspection too... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,680, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Low-k RF rod for RF bias power delivery" was invente... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,681, issued on July 14, was assigned to Halliburton Energy Services Inc. (Houston). "Target gas loading for neutron generator" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,682, issued on July 14, was assigned to CANON K.K. (Tokyo). "Electronic apparatus and image pickup apparatus" was invented by Honkai Tomimo... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,683, issued on July 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan). "Radio frequency module, communication device, and fi... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,684, issued on July 14, was assigned to KYOCERA Corp. (Kyoto, Japan). "Wiring board and electronic device" was invented by Yoshiki Kawazu (... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,685, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Cooling assembly with dampened oscillation response" was invent... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,686, issued on July 14, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Masataka Kato (Ogaki, Japan), Sh... Read More