US Patent Issued to KYOCERA on July 14 for "Wiring board and electronic device" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,684, issued on July 14, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Wiring board and electronic device" was invented by Yoshiki Kawazu (Omihachiman, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes an insulating substrate including a first surface, a mount portion positioned on the first surface and equipped with an electronic element, a first signal line and a second signal line positioned parallel to each other on the first surface, and a recess positioned on the first surface. The recess is positioned around a first end as an end of the first signal line and a second end as an end of the second signal line. At least...