US Patent Issued to Intel on July 14 for "Cooling assembly with dampened oscillation response" (Washington, Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,685, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.).

"Cooling assembly with dampened oscillation response" was invented by Phil Geng (Washougal, Wash.), Jeffory L Smalley (Olympia, Wash.), Sandeep Ahuja (Portland, Ore.), Ralph V. Miele (Hillsboro, Ore.) and David Shia (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly...