ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,562, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Cavity-less interconnect component on glass core" was invented ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,563, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Package substrate with branch line patterns ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,564, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Technologies for vertically interconnected glass core architect... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,565, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Package substrate and semiconductor package ... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,566, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Wireless chip-to-chip high-speed data transport" was invented b... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,567, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Printed circuit board, semiconductor package... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,568, issued on June 30, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Substrate having an increased metal trace thickness"... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,569, issued on June 30, was assigned to MINEBEA POWER SEMICONDUCTOR DEVICE INC. (Ibaraki, Japan). "Power semiconductor module and power con... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,570, issued on June 30, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Kohei Tanikawa (Kyoto, Japan).... Read More
ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,571, issued on June 30, was assigned to DENSO Corp. (Kariya, Japan). "Electronic device" was invented by Kenichiro Takagi (Nisshin-city, Ja... Read More