US Patent Issued to Rohm on June 30 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,570, issued on June 30, was assigned to Rohm Co. Ltd. (Kyoto, Japan).

"Semiconductor device" was invented by Kohei Tanikawa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a conductive substrate, first semiconductor elements and a first conductive member. The substrate includes an obverse surface facing in thickness direction. The first semiconductor elements, bonded to the obverse surface, have a switching function. The conductive member includes a first wiring extending in x direction orthogonal to thickness direction; a second wiring spaced from the first wiring in y direction orthogonal to thickness a...