US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Package substrate with branch line patterns and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,563, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Package substrate with branch line patterns and semiconductor package including the same" was invented by Seungmin Kim (Asan-si, South Korea), Byungsu Kim (Cheonan-si, South Korea) and Hwanwook Jung (Gwangmyeong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate includes a base insulating layer, a first main line pattern on a first surface of the base insulating layer, a plurality of first conductive pads on the first surface of the base insulating layer, a plurality of first branch line patterns on the first surface of the ...