US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Package substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,565, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Package substrate and semiconductor package including the same" was invented by Seongho Shin (Suwon-si, South Korea), Sangkyu Kim (Suwon-si, South Korea) and Yoonseok Seo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate includes a plurality of sequentially stacked insulating layers, a first signal line configured to transmit a first signal therethrough, and a ground line. The first signal line including a first signal via at least partially penetrating the plurality of insulating layers, a first signal pad provided ...