ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,773, issued on Aug. 4, was assigned to Honeywell International Inc. (Charlotte, N.C.). "Bonding layer between stacked integrated circuits" w... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,774, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of forming semiconductor d... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,775, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Fin loss prevention" was invented by ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,776, issued on Aug. 4, was assigned to CAMBRIDGE GAN DEVICES Ltd. (Cambridge, Great Britain). "Power semiconductor device comprising a wide ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,777, issued on Aug. 4, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor device with Schottky contact" was inven... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,778, issued on Aug. 4, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Shinya Umeki (Kyoto, Japan). Ac... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,779, issued on Aug. 4, was assigned to AIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Epitaxial source/drain structures ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,780, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Wall that includes a gas between metal gates of a semiconductor d... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,781, issued on Aug. 4, was assigned to TAIWAN SEMCONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Integrated circuit with a gate structu... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,782, issued on Aug. 4, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit structure with front side signal lines and bac... Read More