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US Patent Issued to Infineon Technologies on Aug. 11 for "Semiconductor module with meltable encapsulant zones" (German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,028, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor module with meltable encapsulant zone... Read More


US Patent Issued to Taiwan Semicondutor Manufacturing on Aug. 11 for "Semiconductor package and method of fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,029, issued on Aug. 11, was assigned to Taiwan Semicondutor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and method of ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Method of filling gaps between dies using silicon dioxide" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,030, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of filling gaps between ... Read More


US Patent Issued to LG INNOTEK on Aug. 11 for "Semiconductor package and manufacturing method therefor" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,031, issued on Aug. 11, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Semiconductor package and manufacturing method therefor"... Read More


US Patent Issued to KYOCERA on Aug. 11 for "Package for accommodating electronic component, electronic apparatus, and electronic module" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,032, issued on Aug. 11, was assigned to KYOCERA Corp. (Kyoto, Japan). "Package for accommodating electronic component, electronic apparatus... Read More


US Patent Issued to Infineon Technologies on Aug. 11 for "Power semiconductor module arrangement and method for assembling the same" (German Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,033, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Power semiconductor module arrangement and method f... Read More


US Patent Issued to TEXAS INSTRUMENTS on Aug. 11 for "Sensor packages" (Philippine Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,034, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Sensor packages" was invented by Jomari Austria (Malabon City, Ph... Read More


US Patent Issued to FUJI ELECTRIC on Aug. 11 for "Semiconductor module, method of manufacturing semiconductor module, and case unit" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,035, issued on Aug. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module, method of manufacturing semiconduc... Read More


US Patent Issued to Samsung Display on Aug. 11 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,036, issued on Aug. 11, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Jun Yong Kim (B... Read More


US Patent Issued to Samsung Display on Aug. 11 for "Display device having reflective structure reflecting light from light emitting diode" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,037, issued on Aug. 11, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device having reflective structure refl... Read More