ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,033, issued on Aug. 11, was assigned to Infineon Technologies AG (Neubiberg, Germany).
"Power semiconductor module arrangement and method for assembling the same" was invented by Alexander Schmer (Soest, Germany) and Markus Stein (Soest, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power semiconductor module arrangement includes: a housing having a plurality of through holes; a substrate forming a ground surface of the housing; and a plurality of terminal elements mechanically and electrically connected to the substrate. A first end of each terminal element is arranged inside the housing and connected to the substrate. Each terminal elem...