US Patent Issued to FUJI ELECTRIC on Aug. 11 for "Semiconductor module, method of manufacturing semiconductor module, and case unit" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,035, issued on Aug. 11, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module, method of manufacturing semiconductor module, and case unit" was invented by Kousuke Komatsu (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes: a semiconductor element; a laminated substrate including a circuit substrate on which the semiconductor element is mounted; a case including a plurality of terminal holes, the case housing the semiconductor element; a plurality of external terminals, each external terminal being inserted into one of two or more terminal holes among the plurality of termi...