ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,031, issued on Aug. 11, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).
"Semiconductor package and manufacturing method therefor" was invented by Tae Sup Choi (Seoul, South Korea), Woon Kang (Seoul, South Korea) and Jin Ho Yoon (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a bonding layer arranged between the solder portion and the connection portion; and an underfill arranged betw...