US Patent Issued to KYOCERA on Aug. 11 for "Package for accommodating electronic component, electronic apparatus, and electronic module" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,032, issued on Aug. 11, was assigned to KYOCERA Corp. (Kyoto, Japan).

"Package for accommodating electronic component, electronic apparatus, and electronic module" was invented by Takuo Kisaki (Satsumasendai, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package for accommodating an electronic component includes an insulating substrate, an external-connection conductor, and a corner conductor. The insulating substrate includes a first surface including a mount portion to receive an electronic component, a second surface opposite to the first surface, a first side surface connecting the first surface and the second surface, a second side sur...