ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,007, issued on Aug. 11, was assigned to Amkor Technology Singapore Holding Pte Ltd. (Singapore). "Semiconductor package and manufacturing m... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,008, issued on Aug. 11, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Electronic package with concave lead end faces" was invented by D... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,009, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package with organic interpose... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,010, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package having first pad and s... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,011, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device, package struc... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,012, issued on Aug. 11, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Package structure" was invented by Ch... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,013, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Substrate with low-permittivity core and buildup layers" was in... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,014, issued on Aug. 11, was assigned to Intel Corp. (Santa Clara, Calif.). "Singulation of integrated circuit package substrates with glass... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,015, issued on Aug. 11, was assigned to Monolithic Power Systems Inc. (Kirkland, Wash.). "Semiconductor device having routing structure" wa... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,016, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si Gyeonggi-do, South Korea). "Semiconductor device" was invent... Read More