US Patent Issued to Advanced Semiconductor Engineering on Aug. 11 for "Package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,012, issued on Aug. 11, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Package structure" was invented by Chun Fu Kuo (Kaohsiung, Taiwan), Shang Min Chuang (Kaohsiung, Taiwan), Ching Hung Chuang (Kaohsiung, Taiwan), Hsu Feng Tseng (Kaohsiung, Taiwan) and Jia Zhen Wang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is disclosed. The package structure includes a first substrate, a second substrate, a gap, and a directing structure. The second substrate is disposed under the first substrate. The gap is between the first substrate and the second substrate. The gap includes a first reg...